System and methods for managing heat in a photonic integrated circuit

ABSTRACT

In part, in one aspect, the disclosure relates to a system including a photonic integrated circuit (PIC) assembly, comprising a PIC comprising: a first bond pad disposed inward from an edge of the PIC a first distance; and a first wire having a first length, the first wire electrically connected to the first bond pad and extending therefrom, wherein the first distance is greater than 0.4 mm.

FIELD

This disclosure relates generally to the field of photonic integratedcircuits.

BACKGROUND

Contemporary optical communications and other photonic systems makeextensive use of photonic integrated circuits that are advantageouslymass-produced for various purposes. These circuits and the componentsthey include and/or connect to are often sources of thermal energy.Managing thermal energy helps enhance device operation and the longevityof various components.

The disclosure includes various methods and system to advantageouslymanage thermal energy and addresses other challenges as discussed below.

SUMMARY

In part, in one aspect, the disclosure relates to a system including aphotonic integrated circuit (PIC) assembly, comprising a PIC comprising:a first bond pad disposed inward from an edge of the PIC a firstdistance; and a first wire having a first length, the first wireelectrically connected to the first bond pad and extending therefrom,wherein the first distance is greater than about 0.4 mm.

In one embodiment, the system further comprises where the first lengthis selected to thermally isolate one or more components of the PIC suchthat during operation temperature variation of PIC ranges from about 49degrees to about 51 degrees. In one embodiment, the system furthercomprises where the first length ranges from about 0.4 mm to about 2 mm.In one embodiment, the system further comprises a housing including anouter surface; and an inner surface defined by a volume of the PICassembly. In one embodiment, the system further comprises where thehousing further includes pins extending outward from the outer surfaceof the housing and connectors along the interior surface of the housingelectrically connected to the pins.

In one embodiment, the system further comprises where the first lengthis greater than the distance between the first bond pad to a firstconnector of the connectors, wherein the first connector is associatedwith the first bond pad. In one embodiment, the system further compriseswhere the length of the wire bonds are about three times the distancebetween the PIC assembly and the interior wall of the housing. In oneembodiment, the system further comprises where the PIC further includesa first region affected by a level of heat proximate to the firstregion; and wherein the first region is disposed distally from each ofthe bond pads. In one embodiment, the system further comprises where thePIC assembly further includes a thermo-electric cooler (TEC), whereinthe PIC is coupled to the TEC; a thermistor disposed on the PICconfigured to provide feedback to the TEC based on a temperaturedetected by thermistor; and a laser diode optically connected to thePIC.

In one aspect, the disclosure relates to a method of manufacturing anoptical transceiver, the method including providing a housing comprisingan interior surface and exterior surface; a plurality of pins extendingoutward from the exterior surface of the housing; an interior volume atleast partially enclosed within the housing; and a plurality ofconnectors along the interior surface of the housing electricallyconnected to the plurality of pins; coupling a PIC assembly to thepackaging within the interior volume of the packaging, wherein the PICassembly includes a plurality of bond pads; and electrically connectingeach of the bond pads uniquely to a connector of the plurality ofconnectors along the interior surface of the housing with a bonding wireat least partially rounded across the distance between each of the bondpads and the associated connector, wherein a length of the bond wire isgreater than a distance between each of the bond pads and the associatedconnector.

In one embodiment, the method further comprises where the PIC assemblyincludes a PIC comprising the plurality of bond pads, wherein the bondpads are disposed inward from an edge of the PIC. In one embodiment, themethod further comprises where the PIC assembly includes a PICcomprising the plurality of bond pads, wherein the bond pads aredisposed towards the center of the PIC. In one embodiment, the methodfurther comprises where the PIC assembly includes a PIC comprising aregion affected by a level of heat proximate to the region, wherein theregion is disposed distally from each of the bond pads.

Although, the disclosure relates to different aspects and embodiments,it is understood that the different aspects and embodiments disclosedherein can be integrated, combined, or used together as a combinationsystem, or in part, as separate components, devices, and systems, asappropriate. Thus, each embodiment disclosed herein can be incorporatedin each of the aspects to varying degrees as appropriate for a givenimplementation. Further, the various apparatus, optical elements,electro-optical devices, inputs, outputs, ports, channels, conductiveelements, bond pads, wires, assemblies, PIC assemblies, wire bonds, heatsources, heat sinks, thermistors, control systems, connectors,components and parts of the foregoing disclosed herein can be used withany laser, laser-based communication system, waveguide, fiber,transmitter, transceiver, receiver, and other devices and systemswithout limitation.

These and other features of the applicant's teachings are set forthherein.

BRIEF DESCRIPTION OF THE FIGURES

Unless specified otherwise, the accompanying drawings illustrate aspectsof the innovations described herein. Referring to the drawings, whereinlike numerals refer to like parts throughout the several views and thisspecification, several embodiments of presently disclosed principles areillustrated by way of example, and not by way of limitation. Thedrawings are not intended to be to scale. A more complete understandingof the disclosure may be realized by reference to the accompanyingdrawings in which:

FIG. 1 illustrates a high level diagram of a laser package with anintegrated photonic integrated circuit (PIC) assembly within a housing,in accordance with one or more embodiments of the disclosure.

FIG. 2 shows a perspective view of a housing of a laser package, inaccordance to one or more embodiments of the disclosure.

FIGS. 3A and 3B show various overhead views of an exemplary PICinstalled or otherwise disposed within a housing, in accordance with oneor more embodiments of the disclosure.

FIG. 4 shows a high level view of an exemplary PIC design, in accordancewith an embodiment of the disclosure.

FIG. 5 shows a cross-sectional component view of a PIC assembly within ahousing, in accordance with one or more embodiments of the disclosure.

DETAILED DESCRIPTION

In part, the disclosure relates to heat management relative to photonictemperature sensitive devices such as electrical, optical, and/oroptoelectronic circuits, devices and the housings and electricalconducting elements associated therewith. In various embodiments, ahousing may also be referred to as a package in various embodiments suchas an integrated circuit package. In many embodiments, the disclosuremay enable design, creation, and/or implementation of a housing andelectrical connections that reduces or minimizes thermal losses such asthermal cross talk relative to one or more of a housing, a photonicintegrated circuit (PIC) disposed within the housing and the environmentin which the housing is located. In some embodiments, the length ofvarious wires or other conductive elements may be advantageouslyincreased by adjusting the position of the connection points of the endsof given wire. In turn, in these embodiments, such an increase in wirelength or the length of the applicable conducting element may result inan increase in thermal resistance, which in turn, may mitigate heattransfer between the PIC and the load it is connected to over a givenwire length.

In various embodiments, a PIC may include a die that include includes asubstrate such as a semiconductor material. In various embodiments, alaser package may include a PIC implemented relative to a siliconphotonics die or other semiconductor die. In certain embodiments, a PICmay include one or more laser wavelength tuning elements or othertemperature sensitive elements. In these embodiments, a change or shiftin thermal transfer or leakage from a housing may improve a PIC'sability to modulate a laser input with precision. In variousembodiments, placement of bond pads and connecting wire bonds may beoperable to reduce the thermal cross talk.

For example, in some embodiments, the effects of thermal cross talk oncomponents of a PIC may be mitigated by placement of bond pads andassociated wire connectors relative to a geometric feature of thehousing such as a boundary or perimeter of one side or surface of thehousing. In some embodiments, by offsetting a given node or electricalconnection relative to the die, the length of the conductive path mayincrease. In many embodiments, a path increase may result in an increasein thermal resistance. Thus, in one embodiment, thermal insulation of aPIC-based device is increased by increasing overall length of one ormore conductors.

Typically, a temperature of a PIC assembly is not uniform across thePIC. Traditionally, current methods of managing thermal leakage useelectronic controls to calibrate and/or compensate for thermal crosstalk, without regard for geometric positioning of electrical contactsand length of conductive elements. Traditionally, electronic calibrationof tuning of a laser requires periodic modification based on a measuredcase/housing temperature. Typically, when there is a lot of thermalcross talk, the calibration of a laser is subject to a large amount oferror. This arises because of the temperature sensitive nature ofvarious lasers.

In most embodiments, one or more portions of a PIC may be sensitive totemperature. In some embodiments, the PIC may include one or moresemiconductor materials that exhibit changes in their behavior as aresult of temperature changes. For example, wavelength tuning elementsthat are fabricated as part of the PIC using silicon may experienceundesirable changes in their operation as a result of temperaturechanges. In these embodiments, changes in temperature may cause anoptical index of refraction to change, which may affect the ability ofthe PIC to precisely modulate a laser input. In various embodiments, tomaintain accurate control of a laser or when attempting to shiftwavelengths, maintaining a consistent temperature is often anadvantageous design feature.

In certain embodiments, when temperature and/or thermal cross talk isignored, a laser may be less accurate in setting a target wavelength. Inthese embodiments, the target wavelength may potentially drift offtarget (due to temperature fluctuations). Additionally, in theseembodiments, an increase in thermal cross talk may increase an amount oferror when modulating a laser input. In addition, Applicant has realizedthat the longevity of a given PIC component can be shortened based onunwanted thermal energy transfers. Various embodiments of the disclosuremay compensate for some or all of the foregoing by adjusting placementof conductive element end points and thereby increasing the length ofsuch conductive elements. In some embodiments, mitigation of thermalcrosstalk may be achieved using wires and bonds pads and otherconductive elements in conjunction with the teachings disclosed herein.

In various embodiments, Applicant has found that the effects of thermalcross talk may be affected by the location of bond pads and the lengthof wire bonds between a PIC and its housing. In these embodiments,thermal cross talk may be reduced by implementing a PIC design where thebond pads, and associated wire bonds, are moved inwards from an edge ofthe PIC. In these embodiments, the inward location of the wire bonds mayallow the wires to have an extended length, which may improve thermalproperties of the laser package and/or the PIC itself. Additionally, incertain embodiments, the effectiveness of reducing thermal cross talk,through wire bond placement, may increase when more connection pointsand more wires of increased length are used to extend from a PIC and itshousing.

In various embodiments, the bond pads being closer to the center of agiven die may enable creating longer wire bonds with the housing, whichmay cause wire bonds to be more thermally resistant or otherwisesuitable for mitigating unwanted heat transfer. In these embodiments,the longer wires provide more separation between the PIC and the housingreducing the overall temperature and variability of the temperature ofthe PIC. In a preferred embodiment, length of the wire bonds may be longenough to allow for thermal isolation while short enough to reduce therisks of shorting across two or more connections. For example, in anembodiment where wires connecting a housing to a PIC are too long, thePIC may become sensitive to vibrations. In these embodiments, the wirescould potentially oscillate back and forth risking a short circuit.

In various embodiments, a PIC assembly may include a PIC and a laserchip placed on a thermo-electric cooler (TEC). In certain embodiments,one or more thermistors may be attached to one or more portions of thePIC assembly to determine a temperature level proximate to eachrespective thermistor. For example, in an embodiment, a thermistor maybe disposed on the PIC itself to determine a temperature for one or moreareas or portions of the PIC. In many embodiments, a thermistor maycommunicate and/or control an activity level of a TEC to manage thetemperature of one or more areas of a PIC assembly and/or one or moreareas within the PIC itself. In some embodiments, a PIC assembly may seta temperature for a system, which is monitored by a thermistor. In theseembodiments, the thermistor manages a thermos-electric cooler (TEC) tomanage the temperature of the PIC assembly.

In many embodiments, a laser chip implemented on a PIC assembly may be atunable laser. In various embodiments, a tunable laser may include aC-band laser. In other embodiments, a tunable laser may include anL-band laser. In various embodiments, of or more techniques of thedisclosure may apply to any device that may require the temperature tobe controlled through thermal isolation such as, but not limited to,photo detectors, modulators, and/or laser elements. In some embodiments,one or more portions of a PIC may be heat sensitive. In theseembodiments, the one or more heat sensitive portions of the PIC may beplaced further away from each of the bond pads. For example, in variousembodiments, thermal cross talk may be worse near the wire bond and /orpad contacts on a PIC.

In various embodiments, the disclosure may describe methods, systems,and/or apparatus' for lengthening a conducting element such as a wire,trace, or wire bond by up to 50% of the length of such a conductingelement in a traditional PIC. In various embodiments, a conductingelement such as a wire, trace, or wire bond may be lengthened by up tothree times the length of such a conducting element in a traditionalPIC. Typically, an integrated circuit has a wire length of about ¾ of amillimeter. Generally, a wire length is measured from where a wiretouches a package to where the wire touches a PIC. However, in someembodiments, a modified PIC configuration may be able to lengthen a wireconnection between the PIC and the housing to about 1.5 millimeters. Inone embodiment, wires, traces or other conductive elements used inconjunction with a temperature sensitive device as disclosed hereinrange in length from about 1 mm to about 3 mm. In another embodiment,lengths of conductive elements range from about 1 mm to about 8 mm. Inone embodiment, a reduction in thermal cross talk is inverselyproportion to length of conducting element. For example, doubling lengthof a conducting element, such as a wire, may halve the amount of heattransfer as a result of the increased resistance. In one embodiment, agiven die has a length and a width. In some embodiments, a given diewidth may range from about 1.5 mm to about 8 mm. In other embodiments, agiven die length may range from about 1.5 mm to about 8 mm. In certainembodiments, a distance from an edge of a die to an electrical contactfrom which a wire extends ranges from about 0.1 mm to about 1.0 mm.

Refer to the example embodiment of FIG. 1 , which illustrates a systemfor integrating a PIC assembly within packaging, in accordance to one ormore embodiments of the disclosure. As shown in FIG. 1 , the lasersystem 100 includes housing 105 and photonic integrated circuit (PIC)assembly 130. The PIC assembly 130 includes a PIC 110, a laser chip 115,a thermo-electric cooler (TEC) 125, and a thermistor 120. In thisembodiment, the TEC 125 cools the laser chip 115 and the PIC 110 basedon feedback from the thermistor 120. If a temperature detected by thethermistor 120 exceeds a pre-set value, the TEC 125 actively cools thePIC assembly 130. Various components within the PIC 110 of the PICassembly 130 are sensitive to temperature. Thermal crosstalk from thehousing 105 is enabled to be managed based on a placement and length ofleads connecting the housing 105 to the PIC assembly 130.

Refer to the example embodiment of FIG. 2 , which illustrates aperspective view of a housing for a photonic integrated circuitassembly, in accordance to once or more embodiments of the disclosure.The housing 200 includes an optical connector 205, Pin connectors 210,input connectors 215, and an internal cavity 220 configured to receive aPIC assembly (130, FIG. 1 ). The housing 200 is enabled to electricallycommunicate and/or connect, via pin connectors 210, to a printed circuitboard (PCB). The pin connectors 210 are connected to the inputconnectors 215 placed within the interior cavity of the housing 200. APIC assembly (130, FIG. 1 ) is enabled to be disposed within the cavity220 and electrically connected with the input connectors 215. A laserchip (not shown) is enabled to be used in conjunction with a PICassembly (130, FIG. 1 ) to transmit and receive optical signals viaoptical connector 205.

Refer to the example embodiments of FIGS. 3A and 3B, which illustrate anoverhead view of a photonic integrated circuit assembly installed withina housing, in accordance with one or more embodiments of the disclosure.The housing 300 includes an outer wall 305 and an optical interfaceconnection 315. On interior walls of the housing 300, are connectionpads 310 electrically connected to external pins (210, FIG. 2 ), wherethe external pins (210, FIG. 2 ) protrude from the exterior of thehousing 300. Disposed within the housing 300 is the PIC assembly (130,FIG. 1 ). As shown, a portion of the PIC assembly 130 includes a PIC 320and a laser chip 335. The PIC 320 includes bond pads 325, which areplaced inward from the edge of the PIC 320. This inward offset distancemay range from about 0.4 mm to about 1.0 mm. A thermistor 330 is placedon the PIC 320 to determine temperature proximate to the PIC 320. Tocomplete the connection between the PIC 320 and the housing 300, wirebonds 340 connect the bond pads 325 with the connection pads 310,thereby completing the electrical connection between the external pins(210, FIG. 2 ) and the PIC 320. The lengths of the wire bonds areincreased as a result of the bond pads being moved inward relative toperimeter or edges of PIC.

Refer to the example embodiment of FIG. 4 , which illustrates an exampledesign of a PIC, in accordance with one or more embodiments of thedisclosure. As shown, the PIC 405 includes bond pads 425, regions(410A-D, 410 generally), regions (415A-D, 415 generally), and regions(420A-D, 420 generally). In many embodiments, temperature may fluctuatenear bond pads. In various embodiments, temperature sensitive componentsmay be further isolated from thermal crosstalk by increasing thedistance between one or more of the bond pads and any temperaturesensitive components (e.g., laser tuning components). Referring back tothe embodiment of FIG. 4 , bond pads 425 are centrally located. Thus,regions 410 and regions 415 are locations on the PIC 405 designated fortemperature sensitive components, while components that are nottemperature sensitive may be places in regions 420. In variousembodiments, the bond pads may be moved incrementally closer or furtherfrom edges of a PIC. In these embodiments, regions for temperaturesensitive components and regions for non-temperature sensitivecomponents may be moved according to the bond pad placement. Referringback to the example embodiment of FIG. 4 , dotted line 430 shows a wirelead of length ‘L’ connecting a bond pad 425 with housing 400. Line 435indicates a distance between the bond pad 425 and the housing 400. Inthis embodiment, the length ‘L’ is longer then the distance shown byarrow 435. In various embodiments, each wire lead from a bond pad to anassociated connection point at the housing is longer than an absolutedistance ‘L’ from the bond pad to the associated connection point.

Refer to the example embodiments of FIG. 5 , which illustrates across-sectional component drawing of a PIC assembly within a housing, inaccordance with one or more embodiments of the disclosure. As shown inFIG. 5 , the housing 505 includes an interior wall (510A, 510B, 510generally) and a PIC assembly that includes a thermos-electric cooler(TEC) 520, a Photonic Integrated Circuit (PIC) 515, and a thermistor526. Atop each of the interior walls 510 of the housing 505, areinternal pin connectors (530A, 530B, 530 generally), which areelectrically connected to external pins (540A, 540B, 540 generally). Asshown, the PIC 515 is electrically connected to each of the internal pinconnectors 530 using leads and/or wire bonds (535A, 535B, 535generally). In the embodiment of FIG. 5 , each of the leads 535 connectsat approximately the same height. In this instance, the distance betweenan internal pin connector 530-B and a bond pad on the PIC 515 isindicated by line 545, which is a distance ‘D’ that is equal to anabsolute distance between the internal pin connector 530-B and the bondpad on the PIC 515. However, each lead (for example lead 535A) loopsupward extending a length of each lead beyond an absolute distancebetween the PIC 515 and the internal pin connector 530. In thisinstance, lead 535-A connects to the internal pin connector 530-A, atfirst contact point 550A, and connects to the PIC 515 at second contactpoint 550B. Similarly, lead 535-B connects to the internal pin connector530-B, at third contact point 550D, and forth contact point 550C at thePIC 515.

Having thus described several aspects and embodiments of the technologyof this application, it is to be appreciated that various alterations,modifications, and improvements will readily occur to those of ordinaryskill in the art. Such alterations, modifications, and improvements areintended to be within the spirit and scope of the technology describedin the application. It is, therefore, to be understood that theforegoing embodiments are presented by way of example only and that,within the scope of the appended claims and equivalents thereto,inventive embodiments may be practiced otherwise than as specificallydescribed. In addition, any combination of two or more features,systems, articles, materials, and/or methods described herein, if suchfeatures, systems, articles, materials, and/or methods are not mutuallyinconsistent, is included within the scope of the disclosure.

Also, as described, some aspects may be embodied as one or more methods.The acts performed as part of the method may be ordered in any suitableway. Accordingly, embodiments may be constructed in which acts areperformed in an order different than illustrated, which may includeperforming some acts simultaneously, even though shown as sequentialacts in illustrative embodiments.

The phrase “and/or,” as used herein in the specification and in theclaims, should be understood to mean “either or both” of the elements soconjoined, i.e., elements that are conjunctively present in some casesand disjunctively present in other cases.

As used herein in the specification and in the claims, the phrase “atleast one,” in reference to a list of one or more elements, should beunderstood to mean at least one element selected from any one or more ofthe elements in the list of elements, but not necessarily including atleast one of each and every element specifically listed within the listof elements and not excluding any combinations of elements in the listof elements. This definition also allows that elements may optionally bepresent other than the elements specifically identified within the listof elements to which the phrase “at least one” refers, whether relatedor unrelated to those elements specifically identified.

The terms “approximately” and “about” may be used to mean within ±20% ofa target value in some embodiments, within ±10% of a target value insome embodiments, within ±5% of a target value in some embodiments, andyet within ±2% of a target value in some embodiments. The terms“approximately” and “about” may include the target value.

In the claims, as well as in the specification above, all transitionalphrases such as “comprising,” “including,” “carrying,” “having,”“containing,” “involving,” “holding,” “composed of,” and the like are tobe understood to be open-ended, i.e., to mean including but not limitedto. The transitional phrases “consisting of” and “consisting essentiallyof” shall be closed or semi-closed transitional phrases, respectively.

Where a range or list of values is provided, each intervening valuebetween the upper and lower limits of that range or list of values isindividually contemplated and is encompassed within the disclosure as ifeach value were specifically enumerated herein. In addition, smallerranges between and including the upper and lower limits of a given rangeare contemplated and encompassed within the disclosure. The listing ofexemplary values or ranges is not a disclaimer of other values or rangesbetween and including the upper and lower limits of a given range.

Embodiments disclosed herein may be embodied as a system, method orcomputer program product. Accordingly, embodiments may take the form ofan entirely hardware embodiment, an entirely software embodiment(including firmware, resident software, micro-code, etc.) or anembodiment combining software and hardware aspects that may allgenerally be referred to herein as a “circuit,” “module” or “system.”Furthermore, embodiments may take the form of a computer program productembodied in one or more computer readable medium(s) having computerreadable program code embodied thereon.

1.-13. (canceled)
 14. An optical transceiver comprising: a housingcomprising an interior surface and exterior surface; a plurality of pinsextending outward from the exterior surface of the housing; an interiorvolume at least partially enclosed within and defined by the housing; aplurality of connectors disposed along the interior surface of thehousing, the plurality of connectors electrically connected to theplurality of pins; and a PIC assembly comprising a plurality of bondpads, the PIC assembly disposed in the interior volume, wherein each ofthe bond pads is uniquely electrically connected to an associatedconnector of the plurality of connectors along the interior surface ofthe housing with a bonding wire at least partially rounded across adistance between each of the bond pads and each associated connector,wherein a length of the bond wire is greater than a distance betweeneach of the bond pads and the associated connector.
 15. The opticaltransceiver of claim 14, wherein the PIC assembly comprises a PICcomprising the plurality of bond pads, wherein the bond pads aredisposed inward from an edge of the PIC.
 16. The optical transceiver ofclaim 14, wherein the PIC assembly comprises a PIC comprising theplurality of bond pads, wherein the bond pads are disposed towards thecenter of the PIC.
 17. The optical transceiver of claim 14, wherein thePIC assembly comprising: a PIC comprising a region affected by a levelof heat proximate to the region, wherein the region is disposed distallyfrom each of the bond pads.
 18. The optical transceiver of claim 14,wherein the PIC assembly comprises a PIC comprising a first bond paddisposed inward from an edge of the PIC a first distance; and a firstwire having a first length, the first wire electrically connected to thefirst bond pad and extending therefrom, wherein the first distance isgreater than about 0.4 mm.
 19. The optical transceiver of claim 18wherein the first length is selected to thermally isolate one or morecomponents of the PIC such that during operation temperature variationof PIC ranges from about 49 degrees to about 51 degrees.
 20. The opticaltransceiver of claim 18 wherein the first length ranges from about 0.4mm to about 2 mm.
 21. The optical transceiver of claim 18, wherein thefirst length is greater than the distance between the first bond pad toa first connector of the connectors, wherein the first connector isassociated with the first bond pad.
 22. The optical transceiver of claim18, wherein the length of the wire bonds are about three times thedistance between the PIC assembly and the interior wall of the housing.23. The optical transceiver of claim 18, wherein the PIC furthercomprises a first region affected by a level of heat proximate to thefirst region, wherein the first region is disposed distally from each ofthe bond pads.
 24. The optical transceiver of claim 18, wherein the PICassembly further comprises a thermo-electric cooler (TEC), wherein thePIC is coupled to the TEC; a thermistor disposed on the PIC configuredto provide feedback to the TEC based on a temperature detected bythermistor; and a laser diode optically connected to the PIC.
 25. Amethod of manufacturing an optical transceiver, the method comprising:providing a housing comprising an interior surface and exterior surface,a plurality of pins extending outward from the exterior surface of thehousing, an interior volume at least partially enclosed within thehousing, and a plurality of connectors along the interior surface of thehousing electrically connected to the plurality of pins; and coupling aPIC assembly to a packaging or the housing, wherein the PIC assemblyincludes a plurality of bond pads.
 26. The method of claim 25 furthercomprising electrically connecting each of the bond pads uniquely to aconnector of the plurality of connectors along the interior surface ofthe housing with a bonding wire at least partially rounded across thedistance between each of the bond pads and the associated connector,wherein a length of the bond wire is greater than a distance betweeneach of the bond pads and the associated connector.
 27. The method ofclaim 25, wherein the PIC assembly includes a PIC comprising theplurality of bond pads, wherein the bond pads are disposed inward froman edge of the PIC.
 28. The method of claim 25, wherein the PIC assemblyincludes a PIC comprising the plurality of bond pads, wherein the bondpads are disposed towards the center of the PIC.
 29. The method of claim25, wherein the PIC assembly comprising a PIC comprising a regionaffected by a level of heat proximate to the region, wherein the regionis disposed distally from each of the bond pads.